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Home > Press Room |
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Press Room |
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| 2017-11-27 |
| FactorySmith Fanless Series |
| Introducing FactorySmith's |
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| With FactorySmith, we have customized solutions tailormade for your OEM/ODM IPC project. Our expertise lies in our strong design, engineering and manufacturing capability. We have a well-documented design drawing database in place. We have modules of all types that will fit your project and greatly expedite the turnaround time. Every product featured in our FS brand is not kept in our standard inventory and is exclusively reserved for OEM/ODM. Check out our fanless series created for a variety of different builds: |
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FS-1320 Fanless chassis with innovative passive thermal cooling - specially designed for VIA Pico-ITX PX series
- Designed specially for VIA Pico-ITX PX series motherboard
- Innovative thermal cooling - combination of thermal pads and copper thermal blocks
- Enhanced thermal solution - Extensive aluminum-made heat sink
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FS-11101 1U rackmount fanless chassis for Mini-ITX - Dual extensive aluminum-made heat sinks
- Primary heat sink for CPU: TDP 35W; Secondary heat sink forexpansion card: TDP 45W.
- Supports 1 x expansion slot; 2 x 2.5" hot-swap
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FS-1351 Tower fanless chassis for Mini-ITX motherboard - Tower design, plenty of space for I/O. Supports standard plate I/O.
- Silent, dust-free & energy-efficient operation. (TDP > 35W)
- Expansion slot x 2. Supports wall mounted bracket (Optional)
- Innovative thermal cooling - combination if thermal pads and copper thermal blocks.
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Copyright 2010-2024 iSG Inc. All rights reserved.
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| 8F., No.207-1, Sec. 3, Beixin Rd.,Xindian Dist., |
New Taipei City 23143, Taiwan (R.O.C.)
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| Tel: +886-2-8913-2350 Fax: +886-2-8913-2325 |
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Live Support: Monday - Friday 8:30AM - 5:30PM
Email US: 
Call Us: +886-2-8913-2350
